Tej cuab yeej Hard Vacuum Txheej Tshuab

Cov nyhuv ntawm magnetic teb

Lub unevenness ntawm lub magnetic teb yuav ua rau cov uniformity ntawm zaj duab xis tsis zoo. Lub hauv paus ntsiab lus ntawm magnetron sputtering yog mus cuag cov trajectory ntawm electrons los ntawm magnetic teb, thiab sib tsoo nrog argon atoms ntau li ntau tau. Nyob rau hauv qhov chaw uas lub magnetic teb muaj zog, ntau Ar ntxiv ions yog generatedand bombardment Muaj ntau atoms ntawm lub hom phiaj cov khoom, thiab cov zaj duab xis txheej ntawm lub substrate yog thicker. Ntawm qhov tsis sib xws, qhov twg cov hlau nplaum tsis muaj zog, cov zaj duab xis txheej yog thinner. Obviously, lub zog ntawm magnetic teb kuj yuav cuam tshuam rau tus nqi deposition, qhov deposition npaum li cas yog siab thaum lub magnetic teb muaj zog, thiab vice versa, deposition tus nqi yog tsawg.

Kev cuam tshuam ntawm substrate kub thiab huv

Qhov kub thiab txias substrate tuaj yeem txhim kho qhov adhesion thiab deposition ceev ntawm zaj duab xis, uas yuav tsum tau tshawb xyuas qhov kub thiab txias raws li cov hom phiaj sib txawv. Kev huv ntawm lub substrate muaj kev cuam tshuam zoo rau kev sib txuas ntawm lub substrate thiab zaj duab xis, yog li nws yog ib qho tseem ceeb heev uas yuav tau ua kom zoo ntawm kev tu lub substrate thiab lub tshuab nqus tsev chamber.

Daim ntawv thov

Parameter

Peb lub tuam txhab

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